Semiconductor Materials Books
Introduction to Materials for Advanced Energy Systems
Author: Colin Tong
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: MCE403
Topics: Advanced Energy Systems, Energy resource, energy system development, energy process characterization, energy calculations, energy accounting, sustainable energy development, Dynamic Mechanical Spectroscopy, nano-scale material, micro-scale material, nanoindentation, optical microscopy, electron microscopy, atom probe tomography, advanced x-ray characterization, neutron scattering, phase transformation temperatures, density, specific gravity, thermal conductivity, thermal expansion, electrical conductivity, electrical resistivity, permittivity, permeability, corrosion, oxidation, toughness, materials design, materials modeling, advanced coatings, photovoltaic materials, hybrid solar cells, thermal storage materials, phase change materials, Geothermal electricity, geothermal heat pump, wind resources, wind machinery, energy-generating systems, wind turbine, hydropower technology, ocean energy, hydrogen generation technology, fuel cells, advanced nuclear energy, fission reactors, fusion reactors, thermoelectric materials, piezoelectric materials, pyroelectric materials, magnetostrictive materials, multiferroic magnetoelectric materials, triboelectric materials, artificial photosynthesis
Semiconductor Physics and Devices, 4th edition
Author: Donald Neamen
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, Semiconductor Materials, atomic bonding, quantum mechanics, Statistical Mechanics, Schrodinger’s Wave Equation, Quantum Theory of Solids, energy bands, Electrical Conduction, Drift Current, electron effective mass, Dopant Atoms, Energy Levels, Extrinsic Semiconductor, Charge Neutrality, Carrier Transport Phenomena, Graded Impurity Distribution, Nonequilibrium Excess Carriers, ambipolar transport, Quasi-Fermi Energy Levels, surface effects, Metal–Semiconductor, Semiconductor Heterojunctions, tunnel diode, Schottky Barrier Diode, Metal–Semiconductor Ohmic Contacts, PN Junction Diode, Metal–Oxide–Semiconductor Field-Effect Transistor, Bipolar Transistor, Base Width Modulation, Ebers–Moll Model, Gummel–Poon Model, Large-Signal Switching, optical devices, solar cells, photodetectors, Junction Field-Effect Transistor, Photoluminescence, Electroluminescence, Luminescent Efficiency, Light Emitting Diodes, Laser Diodes, Quantum Efficiency, Power Bipolar Transistors, Gunn diode, Impatt diode, power MOSFETs, thyristor
Building Materials, Revised Third Edition
Author: SK Duggal
School: Bayero University, Kano
Department: Engineering
Course Code: CIV3302
Topics: Building Materials Principal Properties, Structural Clay Products, Brick's Classification, Brick's Testing, Clay Tiles, Terracotta, Porcelain, stoneware, Earthenware, Glazing, Rocks, Stones, Rock-forming minerals, Rock's Classification, Stone Durability, Stones Application, Stone seasoning, wood, wood Products, Trees Classification, Trees growth, Timber Preservation, Timber testing, Timber Structure, Timber's Fire Resistance, Properties of wood, wood products, wood-products applications, Material for making concrete, Cements, Portland cement, Raw materials chemical composition, Cement Hydration, Rate of Hydration, Hydration water requirement, Cements manufacturing, Cements testing, Cement Types, Cements storage, Aggregates, Aggregates classification, Aggregates characteristics, Deleterious Materials, Organic Impurities, Soundness, Aggregates Thermal Properties, Fine Aggregates, Coarse Aggregates, Cinder Aggregates, Mixing water Quality, Effect of mixing water from different source, Water for washing aggregates, Curing water, Lime, Limestone's Impurities, Limestone's Storage, Lime Vs Cement, Pozzolanas, Concrete, water-cement ratio, workability, Maturity, Defects, Re-vibration, Rheology, Non-destructive testing, Admixture for concrete, Concrete Mix design, Building Mortars, Ferrous Metals, Non-Ferrous Metals, Ceramic Materials, Polymeric Materials, Paints, Enamels, Varnishes, Tar, Bitumen, Asphalt, Gypsum, Special Cements, Cement Concretes, Adhesives, Water proofing materials, Fiber, Geosynthetics, Composite Materials, Smart materials, Asbestos, Thermoc0ol, Heat Insulating Materials, Sound Insulating Materials.
Foundations of Materials Science and Engineering, sixth edition
Author: William Smith, Javad Hashemi, Francisco Presuel-Moreno
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207, ENG208
Topics: Atomic Structure, Atomic Bonding, Crystal structure, Amorphous Structure, Solidification, Crystalline Imperfections, Engineering Alloys, Phase Diagrams, Polymeric Materials, ceramics, Composite Materials, corrosion, light, superconductive materials, magnetic properties, biological materials, biomaterials, smart materials, bond, cubic unit cell, diffusion, alloy, metal, stress, strain, Poisson ratio, plastic deformation, gibbs phase rule, cooling curves, copper, iron, steel, cast iron, aluminum, magnesium, titanium, nickel, thermoplastic, thermost, elastomer, rubber, glass, concrete, asphalt, wood, sandwich structures, corrosion rates, metal-matrix, ceramic-matrix, galvanic cells, microelectronics, nanoelectronics, semiconductors, light, electromagnetic spectrum, laser, luminescence, optical fibers, superconducting materials, ferromagnetic, magnetic field, ferromagnetism, tendon, ligament, articular cartilage
SEMICONDUCTOR DEVICES TECHNOLOGY
Author: GA CHUKWUDEBE
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ECE405
Topics: semiconductor Devices, semiconductor transistor, metals, insulators, semiconductors, Semiconductor materials, Atomic structure, chemical bonds, Rutherford Atomic Models, Bohr Atomic Models, Electron energy levels, Energy bands, Atomic bonding, Intrinsic Semiconductors, Extrinsic Semiconductors, minority carriers, majority carriers, Mass action law
Semiconductor Physical Electronics, 2nd edition
Author: Sheng Li
School: Edo University
Department: Engineering
Course Code: EEE315
Topics: Semiconductor, solids, crystal structure, lattice dynamics, semiconductor statistics, Energy Band Theory, Bloch–Floquet Theorem, Kronig–Penney Model, Band-to-Band Radiative Recombination, Band-to-Band Auger Recombination, Charge-Neutrality Equation, Haynes–Shockley Experiment, Photoconductivity Decay Experiment, Impurity Scattering, Phonon Scattering, p-n Junction Diodes, photoelectric effects, solar cells, photodetectors, light-emitting devices, Bipolar Junction Transistors, Metal-Oxide-Semiconductor Field-Effect Transistors, Metal–Semiconductor Field-Effect Transistors, High Electron Mobility Transistors, Hot-Electron Transistors, Resonant Tunneling Devices, Transferred-Electron Devices, Advanced Bipolar Junction Transistors, Heterojunction Bipolar Transistors, thyristors, Zener Breakdowns, Avalanche Breakdowns, tunnel diodes, Thermionic Emission Theory, Metal Work Function, Schottky Effect, ideal Schottky contact
The Science and Engineering of Materials ,Seventh Edition
Author: Donald Askeland, Wendelin Wright
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207, ENG208
Topics: Materials Design, Atomic Structure, Atomic Bonding, interatomic spacing, amorphous materials, lattice, basis, unit cells, crystal structure, Allotropic Transformation, Polymorphic Transformation, Crystal Structures, unit cell, Covalent Structures, diffusion, Fick’s Law, Mechanical Properties, Tensile Test, stress, strain, Nanoindentation, Fracture Mechanics, Fatigue, Fatigue Test, creep, rupture, stress corrosion, Strain Hardening, Annealing, Hot Working, Nucleation, cooling curves, cast structure, casting, Directional Solidification, Single Crystal Growth, Epitaxial Growth, Phase Diagram, Phase Equilibrium, Dispersion Strengthening, Eutectic Phase Diagrams, Eutectoid Reaction, Martensitic Reaction, Tempering, Nonferrous Alloys, Glass-Ceramics, Polymers, Polymerization, Thermoplastics, elastomers, rubbers, adhesives, Composites, Particulate Composites, Fiber-Reinforced Composites, plywood, concrete, asphalt, Electronic Materials, semiconductors, insulators, Electrostriction, Piezoelectricity, Ferroelectricity, Magnetic Materials, Magnetization
The science and engineering of materials Instructors‘ Solution Manual, Fourth Edition
Author: Frank Askeland, Pradeep Phulé, Gregory Lea
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ENG207, ENG208
Topics: Materials Design, Atomic Structure, Atomic Bonding, interatomic spacing, amorphous materials, lattice, basis, unit cells, crystal structure, Allotropic Transformation, Polymorphic Transformation, Crystal Structures, unit cell, Covalent Structures, diffusion, Fick’s Law, Mechanical Properties, Tensile Test, stress, strain, Nanoindentation, Fracture Mechanics, Fatigue, Fatigue Test, creep, rupture, stress corrosion, Strain Hardening, Annealing, Hot Working, Nucleation, cooling curves, cast structure, casting, Directional Solidification, Single Crystal Growth, Epitaxial Growth, Phase Diagram, Phase Equilibrium, Dispersion Strengthening, Eutectic Phase Diagrams, Eutectoid Reaction, Martensitic Reaction, Tempering, Nonferrous Alloys, Glass-Ceramics, Polymers, Polymerization, Thermoplastics, elastomers, rubbers, adhesives, Composites, Particulate Composites, Fiber-Reinforced Composites, plywood, concrete, asphalt, Electronic Materials, semiconductors, insulators, Electrostriction, Piezoelectricity, Ferroelectricity, Magnetic Materials, Magnetization
Automotive Engineering Lightweight, Functional and novel materials
Author: Brian cantor, Patrick Grant, Colin Johnson
School: Federal University of Technology, Owerri
Department: Engineering
Course Code: ATE403
Topics: Future Vehicles, Future Materials Technologies, Automobile Aluminum Sheet, Plastic Technology for Automotive Modules, Functional Materials, Automotive Catalysts, Magnetorheological Fluids, Impact Loading, High-Temperature Electronic Materials, Smart Materials, Light Metals, Formability of Aluminum Alloys, Ductile Magnesium, Enhancement of Crashworthiness in Cellular Structures, Compressive Properties of Cellular Metals, Heavily Deformable Al Alloy, Stainless Steel Sandwich Sheets with Fibrous Metal Cores, Processing metal, Manufacturing metal, Welding metal, Joining metal, Titanium Aluminide-Based Intermetallic Alloys, Casting Processes, Casting Simulation Tools, Damage Tolerance in Composite Structures, High-Performance Autosport Surface TreatmentsComposites
Author: Gaurav Tripathi
School: University of Nigeria, Nsukka
Department: Engineering
Course Code: EGR201
Topics: Materials Science, materials Engineering, Rutherford model, Bohr model, atom, De- Broglie’s atomic model, Atomic bonding, ionic bonding, covalent bonding, Secondary Bonding, metallic bonding, Fluctuating Induced Dipole Bonds, Polar Molecule-Induced Dipole Bonds, Permanent Dipole Bonds, Crystallography, crystal structures, Crystal Lattice, Bravais lattices, Metallic Crystal Structures, Polycrystalline Materials, Non-Crystalline Solids, Miller Indices, Point Defects, Mechanical Properties of Metals, Stress-Strain curve, Elastic deformation, plastic deformation, Tensile Properties, Brinell Hardness Test, Micro-hardness Test, Knoop Hardness Test, Scleroscope Hardness Test, durometer, fracture, creep, dislocation, Solid-Solution Strengthening, Microstructural Exam, Grain size determination, carbon steel, cast iron, alloy, Dielectric Materials, Dielectric strength, Intrinsic dielectric strength, Magnetic Properties, Diamagnetism, Ferromagnetism, Ferrimagnetism, Hard Magnetic Materials, Extrinsic Semiconductor, semiconductor
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